Heat sink compound (also called thermal grease, thermal compound, CPU grease, heat paste, heat sink paste, and thermal interface material) is a sticky paste that's used as an interface between CPU heat sinks and heat sources
Thermal grease (also called CPU grease, heat paste, heat sink compound, heat sink paste, thermal compound, thermal gel, thermal interface material, or thermal paste) is a thermally conductive (but usually electrically insulating) compound, which is commonly used as an interface between heat sinks and heat sources such as high-power semiconductor devices. The main role of thermal grease is to eliminate air gaps or spaces (which act as thermal insulation) from the interface area in order to maximize heat transfer and dissipation. Thermal grease is an example of a thermal interface material.
We offer heat sink compound or also known as heat sink paste which is best most usefull in various applications based on the quantum of heat produced, thermodynamics, MOC, Viscosity etc. electronics applications heat sinks are used to dissipate the heat produced in electronic components, particularly microprocessors and power transistors, into the free air around. . . Heat Sink is a receiver which has infinite capacity to receive the heat without changing its temperature significantly.

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